Copper thickness: 2oz (70um)
Surface finished: Immersion Gold
Soldermask: Green/White
Min.line width/sapcking: 0.3mm/0.25mm
Min hole /PAD: holes 0.2 mm
PCB Technical parameter for reference
|
Project |
Specification |
Factory Assessment |
|
Layers Count |
Min-Max |
1 layer-12ayer |
|
Warp & Twist |
<=0.75% |
|
|
Panel Sizex |
Max |
510*1100MM |
|
Material type |
CEM-3, FR4, Aluminium base, |
|
|
Double Layer |
Copper Foil Thickness |
(0.5 1 2 3 4 )oz |
|
Minimum Core Thickness |
0.4mm |
|
|
Multilayer |
Copper Foil Thickness (Inner Layers ) |
(0.5 1 2 3 )oz |
|
Copper Foil Thickness (Outer Layers) |
(0.5 1 2 3 4 )oz |
|
|
Minimum Core Thickness |
0.1mm |
|
|
Minimum B-stage Thickness |
2.0mil |
|
|
Board Thickness |
Minimum Board Thickness (Double-Sided) |
0.4mm |
|
Minimum Board Thickness (Multilayers Board) |
0.4mm |
|
|
Maximum Board Thickness (Double-Sided) |
3.2mm |
|
|
Maximum Board Thickness (Multilayers Board) |
3.2mm |
|
|
Artwork—Inner layer |
Minimum Line width |
3mil |
|
Minimum space between circuits |
4mil |