eMCP Test Socket Adapters: Support BGA162 and BGA186 from Samsung, Hynix, Sandisk, Toshiba, Intel, HTC, etc.

From

optional 1: eMCP Test Socket_11.5 X 13_0.5 with SD Adapter (compatible BGA162 and BGA186)

optional 2: eMCP Test Socket_12 X 16_0.5 with SD Adapter (compatible BGA162 and BGA186)

Features:

• Frame is changeable,compatible with different IC size( 11.5x13mm / 12x16mm ).
• Manual Clamshell, easy to operate
• Top probe material: Beryllium cuprum
• Insulating material: torlon
• The special head of the probe can stab the oxidation layer of the solder, contact safely and will not damage the solder ball
• Pressure adjustable, make sure pressure could be applied evenly on ic
• Accurate positioning of IC, higher efficiency
• Probe is replaceable, Frame guide is changeable, easy maintenance and low cost
• Long life span (5000 times-mechanical), stable performance
• Hight frequency and high efficiency
• Offer customization service