| Surface Finishing: | Gold/Silver/Tin/OSP |
|---|---|
| Min. Line Spacing: | 0.1mm |
| Min. Line Width: | 0.1mm |
| Min. Hole Size: | 0.1mm |
| Board Thickness: | 6.0mm |
| Copper Thickness: | Inner Layer: 6Oz |
| Base Material: | FR4,High Tg, Bergquist material, PT material, etc. |
| Number of Layers: | 2 |
| Brand Name: | Hitech PCB |
| Place of Origin: | China (Mainland) |
| Surface Treatment: | HASL |
| HDI Board: | 1+N+1, 1+1+N+1+1 |
| Aspect Ratio: | 10:1 |
| PCB: | printd circuit board |
| printed wiring board: | rigid PCB |
| Multilayer PCB: | Multilayer printed circuit board |
| Quick turn PCB: | Rapid Board Prototyping |
| PCB manufacturer: | PCB manufacturing |
| PCB fabrication: | printed circuit board manufacturing |
| PCB supplier: | Quick turn PCB prototpyes |
Quick Details
Specifications
Type: 2 Layers
Laminate: FR4
Board thickness: 1.6mm
Surface finished: Immersion gold
Copper thickness: 35um (1oz)
Solder resist: green color
Trace width/width: 0.25/0.2mm
For telecommunication
Advantages: Competitive price, best quality, prototype and quick turn services.
Materials: FR4, CEM-3, Aluminum, Polyimide, PTFE and High Frequency etc.
Certificates: ISO9001:2008, ISO14001:2004, UL, SGS and REACH compliance.
Technology Capability: Min Line width/spacing(mil): 3.0mil/3.0mil; Max Aspect Ratio: 12:1; Min via hole:0.10mm; Board thickness: 0.2-6.0mm; Max Panel size:24"x43".
Laminate: FR4
Board thickness: 1.6mm
Surface finished: Immersion gold
Copper thickness: 35um (1oz)
Solder resist: green color
Trace width/width: 0.25/0.2mm
For telecommunication
Advantages: Competitive price, best quality, prototype and quick turn services.
Materials: FR4, CEM-3, Aluminum, Polyimide, PTFE and High Frequency etc.
Certificates: ISO9001:2008, ISO14001:2004, UL, SGS and REACH compliance.
Technology Capability: Min Line width/spacing(mil): 3.0mil/3.0mil; Max Aspect Ratio: 12:1; Min via hole:0.10mm; Board thickness: 0.2-6.0mm; Max Panel size:24"x43".