| Surface Finishing: | Gold/Silver/Tin/OSP |
|---|---|
| Min. Line Spacing: | 0.1mm |
| Min. Line Width: | 0.1mm |
| Min. Hole Size: | 0.1mm |
| Board Thickness: | 0.2mm-6.0mm |
| Copper Thickness: | 17um-210um |
| Base Material: | Aluminium |
| Brand Name: | Hitech PCB |
| mulitlayer printed circuit board: | PCB Assembly |
| High density PCB /HDI,: | Heavy Copper Power PCB |
| hard gold board: | Express PCB prototype |
| Flexible board / FPCB: | Impedance Control PCB |
| Bergquist Aluminum based board: | Flex-rigid PCB |
| pcb: | High Density Interconnect PCB |
| PCB manufacturer: | Multi-layer pcb |
| PCB supplier: | Multilayer PCB |
| China PCB: | Chinese PCB |
| PCB manufacturering: | Best quality PCB |
Quick Details
Specifications
Type: 6 Layers with two steps
Laminate: FR4, Tg150
Board thickness: 1.6mm
Copper thickness: 17.5um (Hoz) for all layers
Solder resist: green color
Surface Finish: Immersion gold
Trace width/width: 0.1/0.1mm
Controlled Impedance
Application:computer control
Specialty:
L1-2, L5-6: laser blind via,
L2-3, L4-5: Laser buried via