| Surface Finishing: | Gold/Silver/Tin/OSP |
|---|---|
| Min. Line Spacing: | 0.1mm |
| Min. Line Width: | 0.1mm |
| Min. Hole Size: | 0.1mm |
| Board Thickness: | 0.2mm-6.0mm |
| Copper Thickness: | 17um-210um |
| Base Material: | FR4, Tg150 |
| Number of Layers: | 26 |
| Brand Name: | Hitech PCB |
| Place of Origin: | China (Mainland) |
| China PCB manufacturer: | Flexible PCB |
| PCB Assembly: | Aluminum pcb |
| China PCBA: | Aluminium PCB |
| Heavy Copper Power PCB: | Metal Base PCB |
| High Frequency PCB: | High Density Interconnect PCB |
| Express PCB prototype: | High density PCB |
| Quick turn pcb: | HDI PCB |
| Impedance Control PCB: | Multi-layer pcb |
| Flex-rigid PCB: | Multilayer PCB |
| rigid-flex PCB: | Best quality PCB |
Quick Details
Specifications
Type: 26 Layers Multilayer PCB
Laminate: FR4, Tg150
Board thickness: 4.0mm
Copper thickness: 17.5um (Hoz) for all layers
Solder resist: black color
Surface Finish: Immersion gold
Trace width/width: 0.15/0.15mm
Min. Holes: 0.4mm
Controlled Impedance
Application: Telecommunication