| Surface Finishing: | immersion gold |
|---|---|
| Min. Line Spacing: | 0.075mm |
| Min. Line Width: | 0.075mm |
| Min. Hole Size: | 0.1mm |
| Board Thickness: | 1.0mm |
| Copper Thickness: | 0.5oz |
| Base Material: | FR4, Tg150 |
| Brand Name: | Hitech PCB |
| Place of Origin: | China (Mainland) |
| 8L High density PCB: | buried vias pcb |
| HDI Board: | Mobile main board |
| Printed Circuit Board Fabrication: | High density printed circuit board (PCB) |
| quick turn pcb: | High density board |
| High density PCB: | Rapid Board Prototyping |
| High Density Interconnect PCBs (HDI PCBs): | PCB supplier |
| HDI board: | PCB manufacturer |
| HDI PCB: | China PCB maufacturer |
| micro via PCB: | Best quality PCB |
| bland via PCB: | printed circuit PCB |
Quick Details
Specifications
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Base material: FR4, Tg150
Layer count: 8 layers (HDI PCB)
Surface finishing: immersion gold
Board thickness: 1.0mm
Copper thickness: 0.5oz
Minimum line width: 0.075mm
Minimum line spacing: 0.075mm
Laser drilling + blind and buried drilling
Impedance control
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