| Surface Finishing: | Immersion gold |
|---|---|
| Min. Line Spacing: | 0.1mm |
| Min. Line Width: | 0.89/0.1mm |
| Min. Hole Size: | 0.1mm |
| Board Thickness: | 1.6mm |
| Copper Thickness: | 17.5um (Hoz) for all layers |
| Base Material: | FR4, Tg150 |
| Brand Name: | Hitech PCB |
| Place of Origin: | China (Mainland) |
| High density board.: | Best quality PCB |
| High density printed circuit board (PCB): | China supplier PCB |
| Mobile main board: | China manufacturer PCB |
| buried vias PCB: | pcb |
| blind via PCB: | Printed Circuit Board |
| HDI PCB: | flexible board |
| HDI board: | rigid-flexible board |
| HDI PCBs): | flex-rigid board |
| High Density Interconnect PCBs: | flexible PCB |
| High density PCB: | Chinese PCB |
Quick Details
Specifications
Laminate: FR4, Tg150
Board thickness: 1.6mm
Copper thickness: 17.5um (Hoz) for all layers
Solder resist: green color
Surface Finish: Immersion gold
Trace width/width: 0.89/0.1mm
Min. holes:0.1mm
Controlled Impedance
Application: Industry control