| Surface Finishing: | immersion gold |
|---|---|
| Min. Line Spacing: | 0.1mm |
| Min. Line Width: | 0.1mm |
| Min. Hole Size: | 0.1mm |
| Board Thickness: | 1.23mm |
| Copper Thickness: | 17um-210um |
| Base Material: | FR4, Tg150 |
| Number of Layers: | 10-Layer |
| Brand Name: | hitech PCB |
| Place of Origin: | China (Mainland) |
| High density PCB: | PCB |
| High Density Interconnect PCBs (HDI PCBs): | printed circuit board |
| HDI board: | rigid board |
| HDI PCB: | flexible board |
| micro via PCB: | rigid-flexbile board |
| blind via PCB: | PCB board |
| buried vias PCB: | PCB |
| Mobile main board: | China Manufacturer PCB |
| High density printed circuit board (PCB): | China Suppier PCB |
| High density board: | Best quality PCB |
Quick Details
Specifications
Layer Count: 10-layer (Any-layer HDI)
Finish board thickness: 1.23mm
Material: FR4, Tg150
Surface finishing: immersion gold
Line width and space: 0.1/0.1mm
Special technology: laser blind via 0.1mm,copper plating over blind via For L5/L6, 0.1mm, Laser drill via, second copper plating over blind via, 4 times lamination
Impedance control tolerance: +/-8%
Through hold size: 0.3mm