| Surface Finishing: | immersion gold+OSP |
|---|---|
| Min. Line Spacing: | 0.13mm |
| Min. Line Width: | 0.13mm |
| Min. Hole Size: | 0.1mm |
| Board Thickness: | 1.0mm |
| Copper Thickness: | 17um-210um |
| Base Material: | FR4, Tg150 |
| Number of Layers: | 10-Layer |
| Brand Name: | Hitech PCB |
| Place of Origin: | China (Mainland) |
| High density board: | Mobile main board |
| Rapid Board Prototyping: | blind viaPCB |
| Quick turn PCB prototype: | buried vias PCB |
| Multilayer printed circuit board: | micro via PCB |
| Multilayer PCB: | HDI PCB |
| rigid PCB: | HDI board |
| printed wiring board: | High Density Interconnect PCBs (HDI PCBs) |
| printed circuit board: | High density PCB |
| High density printed circuit board (PCB): | Best quality PCB |
Quick Details
Specifications
Layer Count: 10-layers (HDI PCB with3+4+3 stack up)
Mobile Phone main board
Finish board thickness: 1.0mm
Material: FR4, Tg150
Surface finishing: immersion gold+OSP
Line width and space: 0.13/0.13mm
Special technology: HDI PCB with 3 + 4 + 3 Layers, 4mil Blind and 12mil Buried Via
Impedance control tolerance: +/-8%
Through hold size: 0.3mm