| Surface Finishing: | Immersion gold |
|---|---|
| Min. Line Spacing: | 0.1mm |
| Min. Line Width: | 0.1mm |
| Min. Hole Size: | 0.4mm |
| Board Thickness: | 2.4mm |
| Copper Thickness: | Inner layer 6 Oz, out layer, 6Oz |
| Base Material: | FR-4 |
| Brand Name: | Hitech PCB |
| Place of Origin: | China (Mainland) |
| High density PCB: | PCB |
| High Density Interconnect PCBs (HDI PCBs): | printed circuit board |
| HDI board: | printed wiring board |
| HDI PCB: | rigid PCB |
| micro via PCB: | Multilayer PCB |
| blind via PCB: | Multilayer printed circuit board |
| buried vias PCB: | Quick turn PCB prototype |
| Mobile main board: | Rapid Board Prototyping |
| High density printed circuit board (PCB): | PCB manufacturer |
| High density board: | PCB manufacturing |
Quick Details
Specifications
Technical description,
Layer: 4L Heavy copper board
Material: FR-4
Board thickness: 2.4mm
Surface finished: Immersion gold
Cooper thickness: Inner layer 6 Oz, out layer, 6Oz
Min through hole: 0.4mm
Power PCB