| Surface Finishing: | ENIG (Electroless Nickel, Immersion Gold) |
|---|---|
| Min. Line Spacing: | 0.1mm |
| Min. Line Width: | 0.1mm |
| Min. Hole Size: | 010" |
| Board Thickness: | .067"+/-.006 |
| Copper Thickness: | 4 oz cu clad internal, 4 oz finish external |
| Base Material: | Laminate - FR4 Hi Tg (170 deg) |
| Brand Name: | Hitech PCB |
| Place of Origin: | China (Mainland) |
| Printed Circuit Board Fabrication: | Multilayer PCB |
| Quick turn PCB prototpyes: | rigid PCB |
| PCB supplier: | printed wiring board |
| printed circuit board manufacturing: | printed circuit board |
| PCB fabrication: | pcb |
| PCB manufacturing: | High density board |
| PCB manufacturer: | High density printed circuit board (PCB) |
| Rapid Board Prototyping: | Mobile main board |
| Quick turn PCB prototype: | buried vias PCB |
| Multilayer printed circuit board: | blind via PCB |
Quick Details
Specifications
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Industry: Computer
Applications: Power Supply PCB
Type: Heavy copper board
Layer count: 8L
Thickness: .067"+/-.006
Material(s): Laminate - FR4 Hi Tg (170 deg)
Copper: 4 oz cu clad internal, 4 oz finish external
Finish: ENIG (Electroless Nickel, Immersion Gold)
Vias: .010" thru hole and .008" Double Blind IVH.006"/.009"
Impedance: 50 ohm Single Ended; 100 ohm Differential (+/-10% tol.)
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