| Surface Finishing: | Immersion Gold |
|---|---|
| Min. Line Spacing: | 0.1mm |
| Min. Line Width: | 0.13/0.13mm |
| Min. Hole Size: | 0.25mm |
| Board Thickness: | 1.6mm |
| Copper Thickness: | 17.5um (Hoz) |
| Base Material: | FR4+PI |
| Number of Layers: | 4 |
| Model Number: | As request |
| Brand Name: | Hitech PCB |
| Place of Origin: | China (Mainland) |
| China PCB manufacturer: | Flexible PCB |
| PCB Assembly: | Aluminum pcb |
| China PCBA: | Aluminium PCB |
| Heavy Copper Power PCB: | Metal Base PCB |
| High Frequency PCB: | High Density Interconnect PCB |
| Express PCB prototype: | High density PCB |
| Quick turn pcb: | HDI PCB |
| Impedance Control PCB: | Multi-layer pcb |
| Flex-rigid PCB: | Multilayer PCB |
| rigid-flex PCB: | PCB board |
Quick Details
Specifications
Laminate: FR4+PI
Board thickness: 1.6mm
Copper thickness: 17.5um (Hoz)
Solder resist: Green color
Surface Finish: Immersion Gold
Trace width/width: 0.13/0.13mm
Min. holes:0.25mm
With Blind and Burid holes
Application: telecommunication