The SD solution is designed for test, debug, validation, and programming of eMMC, eMCP devices
The SD solution provides a compact test solution for eMMC, eMCP devices used in applications such as handheld, mobile, and TV product development. 

Test, debug, validation, and programming of  eMMC, eMCP devices
Failure analysis / System and wafer test
Package and Chip qualification
Production prototype / Data recover
Feature:
Suitable for devices of  Samsung, Hynix, Sandisk, Toshiba, Intel, Kingston etc eMMC and eMCP.
Support eMMC version: ≤eMMC5.0.
Support hot plug, eMMC can be directly connected to PC with SD card reader.
Realize reading, accessing and writting data for eMMC and eMCP devices
Specification:
Mechanical
Socket Body: Torlon
Socket Lid: Aluminum Alloy
Contact: Spring Probe
Operation Temperature: -40oC to 120oC
Life Span at Operating Travel:100K Cycles min.
Cycles Spring Force:27gf per Pin
Electrical
Current Rating (Continuous) : 2.59A
Self Inductance:1.57nH
Bandwidth -1dB:10GHz
DC Resistance: 42mohm