| Application: | Industrial |
|---|---|
| Grounding: | Standard Grounding |
| Type: | Plug with Socket |
| Model Number: | eMMC153/169 burn in socket |
| Brand Name: | ANDK |
| Place of Origin: | China (Mainland) |
| Apply to eMMC size: | 11.5*13 / 12*16 / 12*18 / 14*18 |
| Pin Pitch: | 0.5 mm |
| Pin: | 30 |
| Structure: | Clamshell |
Quick Details
Specifications
1. Apply to eMMC of Samsung, Sandisk, Toshiba, Hynix, Micron, HTC, MTK and Intel.
2. Apply to BGA 169 and BGA 153 testing.
3. eMMC data could be read and written fastly.
4. With 30 pins and pin pictch 0.5mm.
5. eMMC size of this product is 11.5x13mm
6. Apply to eMMC thickness of 0.8mm and 1.5mm.
7. Accurate positioning on flat bottom pad and solder of eMMC.
8. Life cycle is around 25,000 times.
9. Support flat bottom and solder ball testing.
We provide one frame guide for each fixture , If you need more, please pay another $10 for per standard size plate.