1. Pogo Pin Solution: beryllium cuprum(standard).

2. Special probe head can stab the oxidation layer of the solder, assuring stable contact and not damaging the solder ball  

3. Adopting Torlon As The Insulation Material. Engineering Material.

4. Compatible With LGA60, LGA52,IC Size:14*18mm  12*18mm.

5. Accurate Positioning On Test Pad or Solder Ball.

6. Long Life Usage(50,000 times), High Quality and Stable Performance.

7. Pressure Ajustable Design So As To Compatible With IC Thickness From 0.8-1.5mm.

8.Compatible With Samsung,Hynix,Sandisk,Toshiba,Intel,etc iNAND chip.

9: Feature: Manual Clamshell, easy to operate.

 

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