| Surface Finishing: | ENIG |
|---|---|
| Min. Line Spacing: | 0.1mm |
| Min. Line Width: | 0.075mm |
| Min. Hole Size: | 0.1mm |
| Board Thickness: | 1.6mm |
| Copper Thickness: | 1oz |
| Base Material: | High tg FR4 |
| Number of Layers: | 14 |
| Model Number: | PCB-20 |
| Place of Origin: | China (Mainland) |
| High TG FR4: | 14 layers |
Quick Details
Specifications
Monthly capacity: 14,000 square meters
Layers: 2 to 42 layers
Product type: HDI PCB, HF PCB, RF PCB, heavy copper PCB(7oz), rigid-flex PCB,Metal core PCB
Board material:
Normal PCB: FR4 ( Shengyi S1141)
HF PCB material: Rogers, Taconic, Arlon
High TG PCB material: S1000-2M, IT180A
Halegon free material: Shengyi S1155, S1165 series,
Solermask: Taiyo (PSR-2000/4000)
Chemical medicine: (MS300), (125T, EP1000)
Finish: HASL, Led-free HASL, ENIG, OSP, Immersion tin, Immersion silver, Flash gold(50U")
Selective finish: ENIG+OSP,ENIG+gold fingers,Immersion silver+gold fingers,Immersion tin + gold fingers
Technics:
Min line width/gap: 2mil
Min hole size: 3 mil
Min solder ring: 4 mil
Min layer thickness: 2 mil
Max copper thickness: 7oz
Max board size: 600X800mm
Board thickness: 0.2 to 7.0mm
Min soldermask bridge: 3 mil
Max aspect ratio: 26: 1
Plug hole: 0.2 to 0.8mm
Tolerance:
PTH: ±0.075m
NPTH: ±0.05mm
Outline: ±0.1mm
Function test:
insulation resistance: 50 ohms
peel strength: 1.4N/mm
thermal stress test : 280 ℃ for 20 second
Min soldermask hardness: 6H
test voltage: 10V-250V
warp degree: ≤0.7%