| Type: | Other |
|---|---|
| After-sales Service Provided: | Engineers available to service machinery overseas |
| Certification: | ce |
| Usage: | repair bga chips machine |
| Weight: | 130kg |
| Dimensions: | s |
| Rated Duty Cycle: | s |
| Rated Capacity: | s |
| Current: | s |
| Voltage: | 220 |
| Model Number: | wds-750 |
| Brand Name: | wisdomshow |
| Place of Origin: | China (Mainland) |
| warranty: | 1 year |
Quick Details
Specifications
computer repair systems WDS-750 xbox360,PS3, mobile machine, repair bga machine bga reballing chip machine
- Touch screen with human interface,heating time,heating temperature,reflow temperature rate,advanced alarming,vacuum time all can set inside the touch screen,simple operation,easy learn.
- PLC import from Japan,temperature control module use China famous brand,display three temperature curves,4pcs independent temperature sensor,which can measure the different place temperature of the chips,make sure the rework rate
- Three independent heating temperature zone,each heating temperature zone can independently set the heating temperature ,heating time,rate;six heating temperature sections,Simulate the reflow oven heating mode[preheating,constant,warming,soldering,reflow soldering,cooling]
- Auto feed chips,pick up chips,blowing chips;auto recognition chips place during alignment Multifunction mode [weld,remove,mount,manual],realize semi auto and auto function ,meet customer's requirement
- High precision K-type Closed Loop import from USA together with our company special heating way,the soldering rang of temperature within±1℃
- Imported optical alignment system with 15''high definition monitor;high precision micrometer adjust X/Y/R axis;make sure the alignment precision within 0.01-0.02mm.
- Top heater and mounting heater design2 in 1 which can make the mounting more precision;there are many sizes of BGA nozzles which can meet different chips sizes,BGA nozzles can easy change,we accept customize.
- High automatic and precision,Completely avoid human operation error; it is good for reworking lead free craft and double BGA,QFN,QFP,capacitance-type resistor components which can achieve good result.
- Additional monitoring camera which can observe the solder ball melting and easy to check the temperature curve and the soldering result(optional function )
Specifications of WDS-750 BGA Chips Reballing Machine
|
Power |
6800W |
|
Up heater power |
1200W |
|
Down heater power |
1200W |
|
IR heater power |
4200W(2400W control) |
|
Power supply |
(Single Phase) AC 220V±10 50Hz |
|
Position way |
Optical lens+ Vshape holder+laser positioning |
|
Temperature control |
High precision K shape sensor(Closed Loop),up and down independent temperature heating zone,Precision can reach±1℃ |
|
Material |
High sensitive touch screen+temperature control module+PLC+step drive |
|
PCB Size |
Max:500×450mm |
|
PCB Size |
Min: 10×10mm |
|
Thermo-couple Ports |
4pcs |
|
Chips magnification times |
2-30 |
|
PCB thickness |
0.5-8mm |
|
BGA size |
0.8mm-8cm |
|
Min.chips pitch |
0.15mm |
|
Mounting BGA weight |
1000G |
|
Mounting precision |
±0.01mm |
|
Size |
L670×W780×H850mm |
|
Optical alignment lens |
Motor drive can move front back right left |
|
Weight |
About 90kg |