General Description

Baienwei AlSi alloys include:Silicon content: 27%,42%,50%,60% and 70%, mainly used in electronic packaging field,playing outstanding performance in power electronic device package,
Such as microwave high power devices,integrated circuit modules and T/R modules etc.as an electronic packaging material,AlSi alloy can be used in substrates,housings,carriers and lids, having a better compatibility and heat dissipation to prolong the working life of high power modules. AlSi alloys have the features such as light weight,(density 2.42.7g/cm3),high thermal conductivity,low CTE,high stiffness,excellent machinability,weldability,surface plating performance,hermeticity,high temperature resistance and corrosion resistance etc.

Baienwei adopts rapid solidification and subsequent machining technology, offering a series of electronic packaging services,including R&D,production,subsequent machining and plating.

 

Commonly Used Packaging Materials Performance Comparison

Material	Density g/cm3	Thermal Conductivity W/mK	CTE Ppm/oC	Plateability	Machinability	Weldability	Formability
Copper	8.9	385	16	Good	Good	Good	Good
Titanium	4.5	17	8.9	Fair	Fair	Fair	Fair
Cast Al6061	2.7	195	23	Good	Good	Good	Good
Kovar	8.4	15	6.0	Good	Good	Good	Good
Cu85%W	16.4	180	6.8	Fair	Fair	Fair	Fair
Cu85%Mo	10.0	165	6.8	Fair	Fair	Fair	Fair
Al65%SiC	3.0	170	6.8	Poor	Poor	Poor	Poor
AlSi27	2.6	175	17	Good	Good	Good	Good
AlSi50	2.5	140	11.5	Good	Good	Good	Good