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Model Number: CEX-820
Brand Name: Chengerxun
Usage: Construction
Main Raw Material: Silicone
Classification: Other Adhesives
Place of Origin: China (Mainland)
Thermal Conductivity(W/M-K): >2.0
Thermal Impedance: <0.105
Gravity(G/Ml): >2.5
Evaporation(%): <0.001
Bleed(%): <0.05
Dielectric Constant: >5.1
Viscosity: Liquid
Thixotropic Index: 380 10
Temperature Tolerance(Oc): ~50~340oc
Shlelf Life: 24 months

Specifications

High Thermal Conductivity Thermal Paste for CUP

CEX-820 is a high thermal conductivity thermal grease, low oil yield, low volatility, high reliability, thinner thickness.
Advantages:
1.excellent heat conductivity 
2.good electrical insulation 
3.wide working temperature 

Features:
1. Large temperature range of use ( -30-2180oC )
2. High thermal conductivity, insulation and low temperature performance.
3. Non-toxic, tasteless, no corrosion, and chemical and physical properties of stability
 
Applications:
1. TVs and DVDs
2. CPUs and amplifiers
3. Transistors and semiconductors
4. Power supplies and microwave devices
5. Variable-frequency drives and induction cookers
6. Microwave communications and microwave transmission equipment
Specification


Project Test Result Test Condition Testing Method
Model No. CEX-820

Color Grey 25oC Visual
Thermal Conductivity(W/m-K) >2.0 NO ROCT8.140-82
Thermal Impedance(oC-in2/W) <0.105 25oC ASTM D1470
Gravity(g/ml) >2.5 25oC ASTM D1475
Evaporation(%) <0.001 150oC/24Hours Fed.Std.791
Bleed(%) <0.05 150oC/24Hours Fed.Std.791
Dielectric Constant  A >5.1 100Hz ASTM D150
Viscosity Illiquid 25oC /
Thixotropic Index(1/10mm) 380±10 25oC GB/T-269
Temperature Tolerance(oC) ~50~340oC NO NO
Operating Temperature(oC) ~30~300oC NO NO
Warranty 2 years

Delivery Time 3-5 days


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