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Quick Details

Model Number: CEX-3020AB
Brand Name: Chengerxun
Main Raw Material: Silicone
Classification: Other Adhesives
Place of Origin: China (Mainland)
Appearance: Black,Gray,White(a)/(B)
Part a Viscosity (Cps,25oc): 1520
Part B Viscosity (Cps,25oc): 1750
Mixture Ratio: 1:1
Mixture Viscosity(Cps): 1580
Surface Drying Time: 120-180
Operating Time(Min,25oc): 60
Curing Time (Min,25oc): 360-600
Curing Time(Min,80oc): 30
Shelf Life: 6 months

Specifications

High Quality Electronic Adhesive RTV Silicone Sealant

1. Hight quality

2. Superior bond strength

3. Easy to use

4. Quick dry

What to bond:
High performance epoxy adhesive is the adhesive for households and industries. Suitable for repairs and welds. Makes superior bond strength. Bonds to all metal, plastic, rubber, wood, ceramic, glass and concrete. Resistant to acid, alkali, oil, solvent and chemicals. Non-flammable, non-shrinking and waterproof. Makes metallic grey finish. Can be filled, grinded and drilled.
 
Application:

1.Surface to be repaired should be clean, dry and free of oil.

2.Pierce ends of tubes using cap. Squeeze equal amount of hardener and resin from each tube and mix thoroughly until a uniform color is achieved. Mix only what you can use immediately.

3.Apply to surface to be repaired. Remove excess epoxy.

4.Sets in 3-5 minutes.

Cautions:
1. Mix thoroughly; Apply to at once after mixing, less amount every time.

2. Cover tightly after using, do not confuse the caps.

3. Wash off the additional glue by alcohol before its solidifying.

4. Avoid eyes and skin contact.

5. Keep out of reach of children, guard against to enter into mouth.
Before curing Project CEX3020

Appearance Black,Gray,White(A)/(B)





3020

Part A Viscosity (cps,25oC) 1520

Part B Viscosity (cps,25oC) 1750
Operating performance Mixture ratio 1:1

A:B

Mixture viscosity(cps) 1580

Surface drying time (min,25oC) 120-180

Operating time(min,25oC) ≤60

Curing time (min,25oC) 360-600

Curing time(min,80oC) 30
After curing Hardness(shore A) 35-45

Thermal conductivity  [W(m·K)] ≥0.8

Dielectric strength(kV/mm) ≥27

Dielectric strength(1.2MHz) 3.0~3.3

Volume resistance(Ω·cm) ≥1.0×1016

Thermal expansion coefficient [m/(m·K)] ≤2.2×10-4

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