| Style: | open top/zip lock/self-adhesive |
|---|---|
| Size: | Customized |
| OEM Printing: | accpetable |
| Thickness: | 0.05mm-0.1mm(2mil -4mi) |
| Tear initiation: | more than 2.5 ibs./in |
| Tear resistance: | more than 8 ibs./in |
| Tensile strength: | more than 18 ibs./in |
| Heat seal pressure: | 30-70 P.S.I |
| Surface resistivity: | 10^8-10^11 Ohm/sq |
| MVTR: | CC/100in-2/24hrs |
Quick Details
Specifications
1. All sizes are available in open top/zip lock/self-adhesive/gusset/cubic styles
2.Material structure: metal-in dissipative polyester outer layer/aluminum shielding layer/static dissipative polyethylene or polypropylene inner layer
Technical Parameters
|
NO. |
Item |
Unit |
Test standard and result |
|
1 |
Metal layer resistance |
Ohm/sq |
<100 |
|
2 |
Metal layer optical transmission |
Optical density |
40%-70% |
|
3 |
Surface resistivity |
Ohm/sq |
10^8-10^11 |
|
4 |
Time for static removal |
5000-0V |
<0.01 sec FTMS 101 B Method 4046 |
|
5 |
Puncture resistance |
P.S.I |
ASTM D3420 >100 |
|
7 |
MVTR |
gm/100in-2/24hrs |
ASTM E 96 <0.2 |
|
8 |
Oxygen Barrier |
CC/100in-2/24hrs |
ASTM D 3985 <0.5 |
|
9 |
Hot sealing temperature |
F |
250-375F |
|
10 |
Seal strength |
N/15mm |
25.2 |
Main Functions
1. Preventing products from damages due to static
2. Packing electronic products : PC board, IC integrated circuit ,CDdriver, HD ETC
3.Four -layer structure can create such effect as an inductivecover to separate the goods inside from the static field.
4.The inner layer made from ethane can remove the static and avoid static generation inside the bag