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Specifications

Features
As a very important equiment in wafer biscuit production line,this wafer biscuit cutting machine can cut double-deck or three-deck wafer biscuit with filling into small rectangle or square shape. One set of this machine can be coordinated wok with 4 set of wafer biscuit making machines.
This machine is simple structure, convenient operation and easy to clean, the finished wafer biscuit will be regular, well-distribute and clearly cut-side. The machine is easy to operate  and are welcomed by users !

 
Technical Data
Model GG-7
the max size of wafer 465 mm*320mm
Component materials in contact with food 304 stainless steel or PU
Voltage 3-phase 380V ,50 Hz
Dimension 2200*1300*850mm
Weight 500kg