| Type: | Soldering Station |
|---|---|
| After-sales Service Provided: | No overseas service provided |
| Certification: | CE,FDA,ISO |
| Usage: | BGA Repair |
| Weight: | 63KG |
| Dimensions: | 74*68*73 |
| Model Number: | RW-SP380II |
| Brand Name: | Shuttle Star |
| Place of Origin: | China (Mainland) |
| Condition: | New |
| Application 1: | BGA |
| Application 2: | CPU |
| Application 3: | LAPTOP |
| Application 4: | IMAC |
| Application 5: | DESTOP |
| Application 6: | SET TOP BOX |
| Application 7: | PS3 |
| Application 8: | PS4 |
| Application 9: | XBOX360 |
| Application 10: | PC |
Quick Details
Specifications
Feature:
PCB dimension:W50*D50~W450*D400
Temperature control:K-type thermocouple,close cycle controlled
PCB locating way:Jig
Area heater: 2700W
Top heater Hot gas :600W
Bottom heater Hot gas :800 W
Power supply: Single phase 220V,50/60Hz,
Machine size: L660*W630*H600mm
Weight Appox. :60kg
Details:
1. Made of quality heating material;desoldering and solding procedures of BGA are precisely controlled;
2. The movable heating head,which is able to move freely horizontally,is easy to be operated;
3. Embedded industrial computer,Touch screen interface,PLC control,realtime temperature curve display,
able to display temperature curves and detecting curves at the same time;
4. 8 segments of temperature up/down and 8 segments constant temperature control,50,000 groups of
temperature curve are stored,Curve analysis can be carried out on the touchscreen.
5. The temperature of the upper and lower hot air guns can be precisely controlled according to their spectific
temperature, the infrared constant temperature heating zone at the lower part and the appropriate
temperature-control settings make the rework safer and more reliable .
6. The supports for the BGA soldering supporting frame are mirco-adjustable to restrain local sinkage;
7. Powerful cross flow fans cool the lower heating area rapidly.
8. The adjustable PCB positioning support,onto which are special fixtures for allotype board could be installed,
enables easy and fast positioning of the PCB board .
9. Buzz after solding is finished or desoldering;hand vacuum pen is adjustable for removing BGA;
10.Both the upper and lower parts are equipped with over temperature alarming and protection apparatus.
11.With different alloy hot gas nozzles,easy to replace, it could be tailored as per the specific requirements.