| Surface Finishing: | HAL Leadfree, Immersion gold / Tin / Silver |
|---|---|
| Min. Line Spacing: | 0.1mm |
| Min. Line Width: | 0.1mm |
| Min. Hole Size: | 0.15mm |
| Board Thickness: | 3.20mm |
| Copper Thickness: | 8 OZ |
| Base Material: | FR4 |
| Model Number: | ZITROK PCB001 |
| Brand Name: | ZITROK PCB |
| Place of Origin: | China (Mainland) |
Quick Details
Specifications
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Product descriptions:
- Our factory capability and technology
- Material: FR4 (normal and high TG)/CEM-3/PTHE aluminum-base/Rogers/Halogen Free/Rogers/Ferrum and the like
- Layer counts: 2 to 24 layers are available
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Finished board thickness:
- Finished board thickness: two-layer PCB: 0.2-3.2mm, multilayer PCB: 0.6-5.0mm
- Board thickness tolerance: more or less than 10%
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Finished copper thickness
- Inner: 17um-190um, outer: 35um-190um
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Drilling/holes:
- Hole position tolerance: more or less than 0.075mm
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Hole size tolerance:
- PTH: more or less than 0.075mm
- NPTH: more or less than 0.05mm
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Plating:
- Copper PTH: 18-40um
- HASL(LF): 2.5um
- ENIG-NI: 3-7um
- Au: 1-5u''
- OSP: 0.2-0.5um
- S/M and silkscreen ink:
- S/M colors: green/matte green, black/matte black, red, yellow, blue, (S/S, D/S)
- Min S/M dam: 0.1mm
- Min S/M clearance: 0.05mm
- Silkscreen/legend colors: normal: white, (S/S, D/S)
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Surface treatments:
- HASL (lead-free), immersion silver, immersion tin, gold finger, flash gold plating, OSP, ENIG (immersion gold): Au thickness: 0.0762um-0.762um
- Ni thickness: 0.0254um-0.127um
- Outline/profiling:
- Panel outline tolerance: +/-0.13mm
- Beveling: 30/45 angle, gold finger angle: 15/30/45/60 angles
- Certificates: RoHS, ISO9001:2008, SGS, UL certificates
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Specialty:
- Special process: blind/buried Via, HDI Microvia, rigid flex
- Special offer: quick-turnaround PCB
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Optional information:
- Delivery: FedEx/DHL/TNT/by air/by sea/freight collect
- Origin: China
- Minimum order quantity: 1pc
- Packaging: carton + vacuum + desiccant
- Samples: not available