| After-sales Service Provided: | Engineers available to service machinery overseas |
|---|---|
| Condition: | New |
| Model Number: | HEI-DIII |
| Brand Name: | HIT |
| Place of Origin: | China (Mainland) |
| Application: | RFID Tag Inlay processing |
| Technology: | Flip-chip Bonding |
Quick Details
Specifications
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Specifications:
Adopts flip-chip bonding technology: pick the die chip from the wafer and bond it directly with the antenna then heat and press, the ACA/NCA glue will solidify and the inlay package is achieved, the equipment integrates dispensing, flip patch, final bonding, online testing, rewind and unwind of substrate transporting module and applies to all kinds of HF/UHF RFID tag inlay efficient packaging.
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Features:
- Based on high-precision positioning technology such as the visual image processing guiding, high-speed trajectory-timing planning and closed-loop control of grating precision feedback, achieve to place microchip (minimum 0.3 x 0.3mm2 chip) fast, precisely and cost effective
- Via tension-positioning mixed control or distributed control, achieve to feed and place precisely in multiple amplitude and long-span flexible membrane matching the point-by-point positioning technology, could adapt domestically antenna substrate and make the antenna cost lower more than 50% than imported substrate
- Use time pressure of non
- Newtonian fluid dispensing process control technology to achieve the precise control of the amount of glue and save 30% of the cost compared with traditional dispensing process
- Use the intermittent movement, the tact control technology of the optimized components to improve the stability of the system while reducing the overall energy consumption more than 60%
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Applications:
- It's applicable to various types of HF/UHF inlay packaging of the field applications, logistics management and traceability, merchants anti–counterfeiting and management, manufacturing logistics and monitor