WDS-750 Main Features:

1) 1.Higher automatic, auto remove,welding,mounting;

2) 2.With double joystick, control the camera ,high precision;

3) 3.Optical alignmetn system,HD camera vision;

4) 4.With laser positioning, do fast to positioning the bga chip on pcb

5) 5.Excellent quality & Powerful function 

6) Easy operation, Demo Video available

WDS-750 BGA rework station Specification:

1. Touch screen with human interface,all operation step will showed on here;

2. PLC import from Japan,temperature control module use China famous brand;

3. Three independent heating temperature zone;

4. Auto feed chips,pick up chips,blowing chips;auto recognition chips place during alignment Multifunction mode weld,remove,mount,manual,realize semi auto and auto function,meet customer's requirement.

5. High precision K-type Closed Loop import from USA .

6. Imported optical alignment system,alignment precision within 0.01-0.02mm.

7.Additional monitoring camera which can observe the solder ball melting;

8.High automatic and precision,good for reworking lead free craft and double BGA,QFN,QFP.