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Quick Details

Model Number: zs-GF-5299
Brand Name: usilicone
Usage: Construction,Electronics
Main Raw Material: Silicone

Specifications

Before the curing 

 

Appearance                                                  A: Trasparent       B: Blue
Relative Density              0.96~1.00(g/cm3)
Viscosity At 25℃

A:650~850           B:650~850 (mPa·s)   


After the curing

 

Penetration Degree     240~280
Fire resistance Flameout Time  <16s
curing time <2h
Complete time     >4h                                         


INSTRUCTIONS

1,A, B glue mix according to the weight of the 1:1 ratio,and only after the row of bubble it can be order to improve the bubble velocity,empty after row and bubble in the process of mixing, and repeat the above step for two to three times.
2,It should be thoroughly remove oil, dirt and other material on the base material before we use the glue.
3,Operable time:15~30min(30℃), the time of start curing:50~60min(25℃), Complele curing time:12h(25℃), 60min(100℃).


MATTERS NEEDING ATTENTION

NOTE

 

There are some materials, such as chemical additives, curing agent and plasticizer can inhibit the curing of our glue.These materials include:
         ?Organic tin and other metal compounds.
         ?Sulfur, polysulfide, polysulfone or other sulfur containing items .
         ?Amine, polyurethane rubber or other ammonia containing items.
         ?The phosphorus or phosphorus containing items.
         ?Some of the flux.
If in doubt, it is recommended that first before use, first do the applicability test.

 

SPECIFICATION TRANSPORT

PACKAGING

 

1,Sample: 10 kg/barrel, 20 kg/barrel, 40 kg/barrel, 50 kg/barrel.

2,6 months shelf life if stored below 25 ℃, when the product passed its expiration date, it should be confirmed without abnormal phenomenon, then that can be used.

3,These products don't belong to dangerous goods, so they can be transported as normal chemicals. But be careful of leakage.

4,Should be ensured  without abnormal phenomenons before being used if the products exceeding retention period.