Before the curing

Appearance	White paste
Relative density	1.60~1.70(g/cm3)
Surface drying time	≤15(min)

 

After the curing

Tensile strength	≥1.5(MPa)
Elongation At Break	≥150(%)
Shear strength	≥2.0(MPa)
Hardness	35~45(Shore A)
Temperature Range	-60~200(℃)
Volume resistivity	2.2×1015 (Ω·cm)
Dielectric strength	20 (kV/mm)
Thermal conductivity	≥0.8[W/(m·k)]
Dielectric constant	3.12(1.2MHz)

Packaging: 300mL / tube,25tubes / box.

F&A

  1. What is the main application about it?

• Well protect against moisture,dust, and have excellent insulating property for electronic components.
•  Internal coating material in transistor and intergrated circuit.
• Trasparent power pouring material.
• Elastic adhesive in optical device.
• Silicone bra for women.

2. How to correctly use it ?

• A, B glue mixed according to the weight of the 1:1 ratio,and after rowing of bubble it can be used. In order to improve defoaming speed ,in the process of mixing, and repeat the above step for two to three times.
•  It should be thoroughly remove oil, dirt and other material on the base material before we use the glue.

3. What should I notice during the using process?

• There are some materials, such as chemical additives, curing agent and plasticizer can inhibit the curing.These materials include:
• Organic tin and other metal compounds.
• Sulfur, polysulfide, polysulfone or other sulfur containing items .
• Amine, polyurethane rubber or other ammonia containing items.
• The phosphorus or phosphorus containing items.
• Some of the flux.

If you are not sure, it is recommended that firstly do the applicability test before using.