● Process Capability:

• SMT (Surface Mount Technology)
  
• THD (Thru-Hole Device)
• Single & double side mixed SMT & THD assembly
• Board type: Rigid board / Rigid-Flex board
• Component Min. size: chip 01005+
• BGA ball pitch 0.2mm+
• IC lead pitch 0.2mm+
• Rohs process / Leaded process
• IC Programming
• X-ray Inspection
• AOI (Automated Optical Inspection)
• Funtional testing