1 Specifiction: 
Layer: 2L
Material: Fr4
Board thickness: . 1.6mm
Copper thickness: 1oz
Surface treatment: Imersion gold
Application: Consumer electronics  
Process capacity

ITEM		PARAMETER
Layers		1-12L
Material Types		FR-4,FR-4(Middle.High Tg,Halogen Free etc)
Max panel size		20"×24.5*
Min track width/space for inner layer		4MIL/4MIL
Min inner layer pad		4MIL
Inner layer copper thickness		0.5(MIN)-4 OZ(MAX)
Outer layer Copper thickness		0.5(MIN)-4 OZ(MAX)
Finished board thickness		0.4-3.2mm
Tolerance of finished board thickness	Thickness<1.0mm	±4MIL
	1.0mm<thickness<2.0mm	±6MIL
	Thickness>=2.0mm	±8MIL
Inner layer surface finishing		Negative Technology
Layers Registration		±4MIL
Min hole-drilling size		0.25MM
Min finished hole size		0.2MM
Hole position accuracy		±3MIL
Slot Tolerance		±5MIL
PTH Tolerance		±3MIL
NPTH Tolerance		±2MIL
Max PTH A.R.		8:1
Hole Wall thickness		≤1MIL
Outer layer image tolerance		2MIL
Min Outer layer track width/space		4/4MIL
SM thickness	Line end	≥15UM
	Line corner	≥7.5UM
SM hardness		≥6H
SM registration tolerance		1.2MIL(MIN)
Min SM dam		3MIL(MIN)
Max hole-plugging size		0.6MM
Surface Finishing		HAL,Immersion Gole,Immersion Silver,OSP
Range of nickel thickness for electroless nickel and immersion gold		3-5UM
Range of gold thickness for electroless nickel and immersion gold		1-3U*
Impedance control and tolerance		±10%
Warp and twist		≤0.75%

2 We offer: 
1~20layers PCB
Aluminum PCB, 
Buried/blind via PCB, 
High frequency PCB, 
3 Why us: 
UL, ISO9001/14001, ISO/TS16949 certified. 
Staff of 1000+. 
19+years experience, annual turnover USD 82Million. 
Full-process workshop--more guaranteed quality and lead time
All exported PCB have double-check before sending out.