| Surface Finishing: | immersion gold |
|---|---|
| Board Thickness: | 1.0mm |
| Copper Thickness: | 0.5oz |
| Base Material: | FR4, Tg150 |
| Model Number: | As request |
| Brand Name: | Hitech Circuits |
| Place of Origin: | China (Mainland) |
Quick Details
Specifications
8layers High density PCB (HDI PCB) for cell phone
Base material: FR4, Tg150
Layer count: 8 layers (HDI PCB)
Surface finishing: immersion gold
Board thickness: 1.0mm
Copper thickness: 0.5oz
Minimum line width: 0.075mm
Minimum line spacing: 0.075mm
Laser drilling + blind and buried drilling Impedance control
Stack up: 1+6+1
Base material: FR4, Tg150
Layer count: 8 layers (HDI PCB)
Surface finishing: immersion gold
Board thickness: 1.0mm
Copper thickness: 0.5oz
Minimum line width: 0.075mm
Minimum line spacing: 0.075mm
Laser drilling + blind and buried drilling Impedance control
Stack up: 1+6+1