| Surface Finishing: | immersion gold |
|---|---|
| Board Thickness: | 1.0mm |
| Copper Thickness: | 0.5oz |
| Base Material: | FR4, Tg170 |
| Number of Layers: | 10-Layer |
| Brand Name: | Hitech Circuits |
| Place of Origin: | China (Mainland) |
Quick Details
Specifications
10layers HDI PCB
Base material: FR4, Tg170
Surface finishing: immersion gold
Board thickness: 1.0mm
Copper thickness: 0.5oz
Minimum line width: 0.1mm
Minimum line spacing: 0.1mm
Laser drilling + blind and buried drilling Impedance control
Board stack up: 1+8+1
Impedance control
Base material: FR4, Tg170
Surface finishing: immersion gold
Board thickness: 1.0mm
Copper thickness: 0.5oz
Minimum line width: 0.1mm
Minimum line spacing: 0.1mm
Laser drilling + blind and buried drilling Impedance control
Board stack up: 1+8+1
Impedance control