| Board Thickness: | 1.6mm |
|---|---|
| Copper Thickness: | 17.5um (Hoz) for all layers |
| Base Material: | FR4, Tg150 |
| Number of Layers: | 10-Layer |
| Model Number: | As request |
| Brand Name: | Hitech Circuits |
| Place of Origin: | China (Mainland) |
Quick Details
Specifications
10L High Density Interconnect board
Laminate: FR4, Tg150
Board thickness: 1.6mm
Copper thickness: 17.5um (Hoz) for all layers
Solder resist: green color
Surface Finish: Immersion gold
Trace width/width: 0.89/0.1mm
Min. holes:0.1mm
Controlled Impedance
Board stack up: 1+1+6+1+1
Application: Industry control
Laminate: FR4, Tg150
Board thickness: 1.6mm
Copper thickness: 17.5um (Hoz) for all layers
Solder resist: green color
Surface Finish: Immersion gold
Trace width/width: 0.89/0.1mm
Min. holes:0.1mm
Controlled Impedance
Board stack up: 1+1+6+1+1
Application: Industry control