| Surface Finishing: | Immersion gold |
|---|---|
| Board Thickness: | 2.4mm |
| Copper Thickness: | Inner layer 6 Oz, out layer, 6Oz |
| Base Material: | FR-4 Tg170 |
| Model Number: | As request |
| Brand Name: | Hitech Circuits |
| Place of Origin: | China (Mainland) |
Quick Details
Specifications
4L Power Copper Core PCB
Technical description,
Layer: 4L Heavy copper board
Material: FR-4 Tg170
Board thickness: 2.4mm
Surface finished: Immersion gold
Copper thickness: Inner layer 6 Oz, out layer, 6Oz
Min through hole: 0.4mm
Power grid switching system PCB
Technical description,
Layer: 4L Heavy copper board
Material: FR-4 Tg170
Board thickness: 2.4mm
Surface finished: Immersion gold
Copper thickness: Inner layer 6 Oz, out layer, 6Oz
Min through hole: 0.4mm
Power grid switching system PCB