| Surface Finishing: | Immersion gold |
|---|---|
| Min. Line Spacing: | 8mil |
| Board Thickness: | 2.6mm |
| Copper Thickness: | 3 Oz for all layer |
| Base Material: | FR-4 Tg170 |
| Number of Layers: | 12-Layer |
| Model Number: | As request |
| Brand Name: | Hitech Circuits |
| Place of Origin: | China (Mainland) |
Quick Details
Specifications
12L heavy copper core pcb printed wiring board
Technical description,
Material: FR-4 Tg170
Board thickness: 2.6mm
Surface finished: Immersion gold
Copper thickness: 3 Oz for all layers
Min.line width/space: 8mil
Min through hole: 0.3mm
High power rectifiers
Technical description,
Material: FR-4 Tg170
Board thickness: 2.6mm
Surface finished: Immersion gold
Copper thickness: 3 Oz for all layers
Min.line width/space: 8mil
Min through hole: 0.3mm
High power rectifiers