Material

• FR-4 TG135~TG200
• CEM1 / CEM3
• Arlon
• Nelco
• Aluminum
• Ceramic
• Kapton 
• BT Material

Capabilities

 

• Layers: 1-42 layers
• Max Board size: 21" x 30"
• Max Board Thickness: 8.0 mm
• Min Board Thickness:  2 layers  0.15mm / 4 layers  0.3mm / 6 layers  0.6mm
• Min Line Width: 3 mil 
• Min Line Space: 3 mil
• Min Mechanical Drill/Pad: 6mil / 16mil
• Min Laser Drill/Pad: 4mil / 10mil
• PTH Dia. Tolerance: +/- 3mil
• NPTH Dia. Tolerance: +/- 1mil
• Hole Position Deviation: +/- 3mil
• Outline Tolerance: +/- 4mil
• Solder Mask Dams: 3mil
• Aspect Ratio Mechanical: 15.1
• Aspect Ratio Laser: 1"1
• Flammability: 94V-0
• Impedance Control: ≤50 OHMS = ±5OHMS / >50 OHMS = ±10%
• Surface Finish: Leaded HASL / Lead Free HASL / Immersion Gold (ENIG) /                                               Immersion Silver / Immersion Tin / Hard Gold (Fingers) /                                                 Selective Hard Gold / Wire Bondable Soft Gold / Flash Gold /                                             OSP / Carbon Ink