Jinpei's new patent products – about a large capacitance, high voltage and high frequency of Multilayer ceramic chip capacitors SMD MLCC (patent application No. 201310172755.5)

 Since found that Jinpei company continually R&D the newest technologies at the industries of componets and capacitors.and built close technical cooperation relationship with some scientific reseach institution and university for example Hunan University, Shanghai University.

     Here briefly introduce, Jinpei company recently successfully developed a new type with a large capacitance, high voltage and high frequency of multilayer ceramic chip  capacitors SMD MLCC, Jinpei part No. CC41/50150N853J152HB,related engineer and some people should know who work at the capacitors industry, the feature of multilayer ceramic chip  capacitors SMD MLCC get a smaller capacitance than similar products such as film capacitors and disc ceramic capacitors,but multilayer ceramic chip  capacitors SMD MLCC get a better temperature coefficient(alleged temperature coefficient mean a capacitors's capacitance follow environment temperature  change will also change,this relationship was called temperature coefficient..for example I medium of NPO or COG, the same material that American habitually call NPO and Japanese call COG,by the way the multilayer ceramic chip capacitors SMD MLCC was invented by the United states and was followed by Japan, it's temperature coefficient is +-30ppm/℃, the mean when temperature change one degree Celsius that the capacitance will change +-30ppm,II medium X7R X5R of temperature coefficient is + -15%, here we will't successively introduce other medium of Y5V Y5P Z5U etc.yet the surge voltage of multilayer ceramic chip capacitors SMD MLCC is the best than other capacitors, it can suffer 250% of rated voltage for five seconds.

     For centralize the advantages of all capacitors to be on one,many engineer try to seek the largest capacitance, highest voltage and highest frequency at a capacitors. for example Jinpei's patent product -multilayer ceramic chip capacitors SMD MLCC part No. CC41/50150N853J152HB,medium NPO or COG usually the best spefication is 1500v 1000pF dimension 7689,Jinpei company successly R&D a Sandwiches structure of technology and it can guarantee after increase the dimension of span to also effectively increase the flexural strength.i can be normally used in a circuit which is high voltage high temperature and high frequency,meanwhile the capacitance has been increased to 85000pF with eight hundred and fiftyPercent.yet the thickness keep changless.

    Like this invention that it's unprecedent in the capacitors industry,it mainly was applied on the High frequency measuring instrument and missile measuring system etc high military industries

Precautions on the use of SMD/chip MLCC high voltage and big capacitance

12.1 PCB Design

12.1.1 Design of Land-patterns

The following diagrams and tables show some examples recommended patterns to prevent excessive solder

amounts (larger fillets which above the component end terminations)

Examples of improper pattern designs are also shown.

Recommended land dimensions for a typical chip capacitor land patterns for PCBs

Recommended land dimensions for wave-soldering (unit: mm)

Recommended land dimensions for reflow-soldering (unit: mm)

Excess solder can affect the ability of chips to withstand mechanical stresses. Therefore, please take proper

precautions when designing land-patterns.

Examples of good and bad solder application

Pattern configurations

The following are examples of good and bad capacitor layout, SMD capacitors should be located to minimize

any possible mechanical stresses from board warp or deflection..

To layout the capacitors for the breakaway PC board, it should be noted that the amount of mechanical

stresses given depending on capacitor layout. The example below shows recommendations for better design

When breaking PC boards along their perforations, the amount lf mechanical stress on the capacitors can vary

according to the method used. The following methods are listed in order from least stressful to most stressful:

push-back, silt, -grooving, and perforation. Thus, any ideal SMD capacitor layout must also consider the PCB

splitting procedure.

12.2 Considerations for automatic placement

Adjustment of mounting machine

①. Excessive impact load should not be imposed on the capacitors when mounting the PC boards.

②. The maintenance and inspection of the mounters should be conducted periodically.

12.3 Recommended soldering profile

12.3.1 Recommended Sn&Pb soldering profile

Reflow soldering

Caution

①.The ideal condition is to have solder mass (fillet) controlled to 1/2 to 1/3of the thickness of the capacitor, as

shown below:

②. Because excessive dwell times can detrimentally affect solderability, soldering duration should be kept as

close to recommended times as possible.

Wave solder profile

Caution

①.Make sure the capacitors are preheated sufficiently.

②.The temperature difference between the capacitor and melted solder should not be greater than 100 to 130℃.

③. Cooling after soldering should be gradual as possible.

Hand soldering

Caution

①.Use a 20w soldering iron with a maximum tip diameter of 1.0mm.

②.The soldering iron should not directly touch the capacitor.

12.3.2 Recommended Pb-Free soldering profile

Reflow soldering

12.4 Handling

Breakaway PC boards (splitting along perforations)

⑴.When splitting the PC board after mounting capacitors and other components, care is required so as not to

give any stresses of deflection or twisting to the board.

⑵.Board separation should not be done manually, but by using the appropriate devices.

12.5 Storage

⑴. Keep the storage environment conditions as following:

Temperature: 5~40℃

Humidity: ≤70% RH

⑵. Don't open the tape until the parts are to be used, and store them within one year since the date printed on the

reel.

⑶. Use the chips within 3 months after the tape is opened.

⑷. The capacitance value of high dielectric constant capacitors (X7R,X5R,Y5V) will gradually decrease with the

passage of time, so this should be taken into consideration in the circuit design. If such a capacitance reduction

occurs, a heat treatment of 150℃ for 1 hour will return the capacitance to its initial level.37