Product Feature :   The composite made by it possesses good electric insulation capacity, high heat conductivity, superior soft solderability and high adhesion. Additionally, it can also etch different graphs just like PCB plate, and a large current carrying capacity. Therefore, DBC substrate has been used as the basic material in electric & electronic industry at home and abroad.

 

Product Specification / Models :  

ALN Ceramic

Thickness 0.635 0.5 0.38mm

Density 3.3 g/cm3

Binding strength 400 Mpa

Thermal conductivity (at 25 degree Celsius) 170 W/m.k

Dielectric constant (at 1 MHz) 9.0

Dielectric loss (at 1 MHz, 25 degree Celsius ) 0.0003

Dielectric strength 20KV/mm

Volume resistivity (at 25 degree Celsius)  1*10^14 cm

 

Application :  

Concentrator photovoltail,

Solar converters,

Wind power plants,

Led lighting,

Thermoelectric coolers,

Air conditioning,

Power supplier,

IGBT modules,

IPM modules,

Mos modules,

power construction semiconductor elements,

ABS for auto,

Eletrical power steering,

Hybird Vehicles,

Eletric vehicles,

Laser,

Power supplies,

Hihg speed rail.
 

Copper parameter

Material: Oxygen free high purity copper 99.99%

Copper Thickness: 0.4 0.3 0.25 0.20 0.127mm

DBC Substrate:

Master card size (max.) 138*190 mm

Max. Usable area 127*178mm

Spacing between conductor (min) 0.5mm

Width of conductor (min) 0.5mm

Thermal expansivity (Normally) 7.4 *10^-6  K^-1

Peeling strength >5 N/mm

Soldrability >95%

Surface options bare copper/solder stop/Ni-plating/Au-plating

Other:

We accept custom-made orders according to specific requests.

Some value maybe a little bit different from the table according to specification conditions.