| Type: | Other |
|---|---|
| After-sales Service Provided: | Engineers available to service machinery overseas |
| Certification: | ce |
| Usage: | reballing bga machine |
| Weight: | 60 |
| Dimensions: | 66*66*66 |
| Rated Duty Cycle: | 2 |
| Rated Capacity: | 2 |
| Current: | 2 |
| Voltage: | 220/110 |
| Model Number: | wds-700 |
| Brand Name: | wisdomshow |
| Place of Origin: | China (Mainland) |
| name: | bga reballing machine |
Quick Details
Specifications
Our BGA Rework Station/ BGA reballing station are widely used to replace and repair the BGA chip in laptop, mobile phone, xbox360,ps3,etc.
The main user is repairing shops and factory to provide the after-sales service and rework.
How to separate BGA chip from motherboard?
How to replace a new BGA chip?
Repair steps:
1) Separate the BGA chip from mother board –we called desoldering
2) Clean Pad
3) Reballing or replace a new BGA chip directly
4) Alignment/Positioning – Depend on experience ,silk frame ,optical camera
5) replace a new BGA chip - we called Soldering
More details Parameter of WDS-700 bga chip reballing machine
|
1 |
Superior function |
Can create relevant temp.curves according to chips size |
|
2 |
Power supply |
AC 220V±10% 50/60Hz |
|
3 |
Total power |
Max 2500W |
|
4 |
Heater power |
Upper temp.zone 1200W,Down temp.zone 1200W |
|
5 |
Electrical material |
Driving motor+PLC smart temp.controller+color touch screen |
|
6 |
Temperature controlling |
(high precision K-sensor)(Closed Loop),independent temp.controller,the precision can reach ±1℃ |
|
7 |
Locating way |
V shape slot,PCB support jigs can adjust |
|
8 |
PCB size |
Max 140×160mm Min 5×5 mm |
|
9 |
Applicable chips |
Max 80×80mm Min 1×1 mm |
|
10 |
Overall dimension |
L450×W470×H670mm |
|
11 |
Temperature Interface |
1 pcs |
|
12 |
Weight of machine |
30KG |
|
13 |
Color |
Blue+White |