TYPE

3K

3K Dual Lane

Mechanical system (dimensions in mm [inches])

Maximum board dimensions

458 [18] x 406 [16]

2 x 458 [18] x 160 [6.3]

Board thickness (minimum to maximum)

0.7 to 4 mm [0.02 to 0.16]

Maximum board weight

3 kg [6.6 lb]

Maximum inspectable board area

458 [18] x 406 [16]

2 x 458 [18] x 160 [6.3]

Minimum inspectable board area

50 [1.96] x 50 [1.96]

Clearance under camera

34 [1.33]

Clearance under board

34 [1.33] (10 [0.39] closed to clamp blades)

Clamping system edge

3 [0.12]

Board positioning

Board and panel fiducials

XY table

Linear motors and coders

Frame type

Composite granite

P series optical heads

Camera resolution

Pixel size (Sub-pixel technology)

Field size

Perform

2 352 x 1 728

8 μm

61.1 [2.40] x 44.9 [1.76]

Premium

2 352 x 1 728

8 μm

61.1 [2.40] x 44.9 [1.76]

Lighting system

Lighting colors

i-LITE (red, green, blue)

Lighting types

Axial and peripheral

Average inspection speed

4 - 20 ms

Inspection time per component

Average inspection speed for solder paste (contacts per mn)

Perform

58 000

Premium

75 000

Average production cycle time (components per hour)

Perform

250 000

Premium

400 000

Type of components inspected

01005 up to exotic

Software

Operating system

WINDOWS XP

Vision integrated software suite

Standard

Off-line programming software

Optional

Off-line repair software

Optional

Standard Library based on JEDEC packages

Standard

Communication

Upstream / downstream

SMEMA 2

Network

TCP/IP, RJ45 plug

Facilities

Electrical supply

115 / 230 V, 50 / 60 Hz, 16 / 8 A

Electrical consumption

1600 VA

Machine dimensions W x D x H

1000 [39.37] x 1102 [43.38] x 2020 [79.52]

Weight

1200 kg

Transport height

950 ± 50 [37.4 ± 2] (option 850 ± 50 [33.5 ± 2])