| Surface Finishing: | Hot air levelling |
|---|---|
| Min. Line Spacing: | 3mil |
| Min. Line Width: | 3mil |
| Min. Hole Size: | 0.15mm |
| Board Thickness: | 0.1-60mm |
| Copper Thickness: | 35um |
| Base Material: | copper |
| Model Number: | tg280 |
| Brand Name: | Tiantuo Circuits |
| Place of Origin: | China (Mainland) |
Quick Details
Specifications
the following example is for you reference.
Features:
TG280 is a Polyimide resin and glass woven laminate insulation board. Excellent High frequency performance, high temperature resistance and strong Anti-radiation. Used for high frequence Circuit and special heat resistance material.
Technical details: Property Unit Value Test
Method 1. Electrical
Properties Permittivity @ 1 MHz - C-96/40/93 4.1 IPC
TM--650 Dissipation Factor @
1 MHz - C-96/40/93 6.8x 10-3 IPC
TM--650 Volume Resistivity C-96/40/93 MΩ-cm 6.5x 103 IPC
TM--650 Surface Resistivity C-96/40/93 MΩ 1.7 x 105 IPC
TM--650 Dielectric Breakdown kV 40 IPC
TM--650 Arc Resistance sec 156 IPC
TM--650 2. Thermal Properties Glass Transition Temperature (Tg) DSC ℃ 257 IPC
TM--650 Z-axis Expansion (50-260oC) % 1.4 IPC
TM--650 3. Mechanical Properties Flexural Strength MPa 476/250 IPC
TM--650 Tensile Strength (x, y) MPa 429 IPC TM--650 4. Physical Properties Water AbsorptionD24/23 % 0.12 IPC
TM--650 Specific Gravity G/cm3 1.96 IPC TM--650 Flammability V1 UL94
Operation method of useage:
Package: