Pure tin ingot 99.9% 99.95% 99.99%

 

1.High purity(Sn99.99 Sn99.95 Sn99.90), excellent weldability, good infiltration.

2.Clean, beautiful.after welding, insulation, high resistance, low ionic contamination, PCB board welding residual minimal.

3.Good oxidation resistance, low tin slag and cost savings.

4.Solder joint is bright, full and uniform.

5.Economical and can produce the lowest consumption of the solid solder joints.

Specifications

 

Purity(%)	as	Fe	Cu	Pb	Bi	Sb	CD	Zn	Al	Total
99.99	0.0005	0.0025	0.0005	0.0035	0.0025	0.002	0.0003	0.0005	0.0005	0.01
99.95	0.003	0.004	0.004	0.01	0.006	0.014	0.0005	0.0008	0.0008	0.05
99.90	0.008	0.0025	0.008	0.04	0.015	0.02	0.0008	0.001	0.001	0.1