Usage

the machine is used to cut cover layer CVL, flex printed circuit board FPC, flex-rigid circuit board RF. Includes base materials, such as: silicon, ceramics, rubber, FR4, 3M, PP, PI reinforcement; with high quality, high speed cutting thickness of up to 1mm (0.04). There is no burrs, no stratification. The cutting edge and sidewall is smooth.

Feature

1, Precision: Adopting linear motor module, Servo control, sizing compensation, optical positioning and secondary positioning technologies.

2, High quality:  Little carbonization and high density graphics cutting.

3, Highly intelligent, efficient: with multi-panels cutting, auto-positioning, auto-correcting, automatic sizing compensation and exclusive cutting previews functions.

Parametres

Specification of UV Laser Cutting Machine
Model	JG18
Wavelength	355nm
Laser Power	Option (Standard 10W)
Laser Frequency	30-120kHz
Maximum Processing Size	720mm x 540mm (Double platform)
Maximum Operating Speed	800mm/s
Positioning Accuracy of Table	±3μm
Repetitive Positioning Accuracy of Table	±1μm
Total Accuracy	±20um
Light spots	20±5μm
Scanning range	45mmx45mm
File Format	*.Gbr & *.Dxf & *.Lay
Electric Power Supply	AC220V/2kW;  AC380V/5.5kW
Dimensions(L x W x H)	1780mmx1610mmx1650mm
Weight	2300kg
Environmental Temperature	20±2℃
Environmental Humidity	≤60%RH, Non-condensing
Ground Amplitude	≤5μm
Ground Pressure	≥1000Kgf/m2