Usage

the machine is used in cutting,opening the window and uncovery for CVL/FPC/RF and thin multilayer board, as well as cutting a variety of substrates, such as ceramic, silicon etc.

Feature

(1)Precision:

Adopting high-precision linear motor modules, servo control, Sizing Compensate, optical positioning and secondary positioning technologies.

(2)High quality

(a)little carbonization;

(b)high density graphics cutting.

(3)Highly intelligent, efficient

(a)with multi-panels cutting, auto-positioning, auto-correcting, automatically focus, automatic sizing compensation and exclusive cutting previews functions;

(b)JG16 use double working table to save time of feeding and blanking materials.

Parametres

Specification of UV Laser Cutting Machine
Model	JG16
Wavelength	355nm
Laser Power	Option (Standard 10W)
Laser Frequency	30-120kHz
Maximum Processing Size	500mm x 400mm (Double platform)
Maximum Operating Speed	800mm/s
Positioning Accuracy of Table	±3μm
Repetitive Positioning Accuracy of Table	±1μm
Total Accuracy	±20um
Light spots	20±5μm
Scanning range	45mmx45mm
File Format	*.Gbr & *.Dxf & *.Lay
Electric Power Supply	AC220V/2kW;  AC380V/5.5kW
Dimensions(L x W x H)	1850mmx1640mmx1650mm
Weight	2400kg
Environmental Temperature	20±2℃
Environmental Humidity	≤60%RH, Non-condensing
Ground Amplitude	≤5μm
Ground Pressure	≥1000Kgf/m2