| After-sales Service Provided: | No overseas service provided |
|---|---|
| Condition: | New |
| Brand Name: | Nandrepair |
| Weight: | 0.2 |
| color: | blank |
| Model Number: | OCT008 |
| Place of Origin: | China (Mainland) |
| Product Name: | WL BGA Reballing Stencil For iphone |
Quick Details
Specifications
WL BGA Reballing Stencil for iPhone NAND CPU A8 A9 Processor
Note: the upper and lower layers are all-in-one, means that the entire CPU is pulled down, not layered.
Option1:A6 CUP CPU Upper
Option2:A7 CUP CPU Upper
Option3:A6/A7 CPU Lower
Option4:A8 CPU Upper
Option5:A8 CPU Lower
Option6:A8 CPU upper and lower layers are all-in-one
Option7:A9 CPU Upper
Option8:A9 CPU Lower
Option9:A9 CPU upper and lower layers are all-in-one
Option10:A10 CPU Lower
Option11:Full Set (Option 1-10), only send 1PCS Universal Aluminum Mold Base (Golden)
Note: the upper and lower layers are all-in-one, means that the entire CPU is pulled down, not layered.
Option1:A6 CUP CPU Upper
Option2:A7 CUP CPU Upper
Option3:A6/A7 CPU Lower
Option4:A8 CPU Upper
Option5:A8 CPU Lower
Option6:A8 CPU upper and lower layers are all-in-one
Option7:A9 CPU Upper
Option8:A9 CPU Lower
Option9:A9 CPU upper and lower layers are all-in-one
Option10:A10 CPU Lower
Option11:Full Set (Option 1-10), only send 1PCS Universal Aluminum Mold Base (Golden)
