| Surface Finishing: | HASL |
|---|---|
| Board Thickness: | 0.8mm |
| Copper Thickness: | 0.5oz-5oz |
| Base Material: | FR-4 |
| Brand Name: | Aircloud |
| Min. Line Spacing: | 3 Mil |
| Min. Line Width: | 3 Mil |
| Min. Hole Size: | 0.20mm |
| Model Number: | P1 |
| Place of Origin: | China (Mainland) |
| Product name: | PCB Copy Service |
| PCB Layer: | Double layer |
| Certificate: | ISO/UL/RoHS |
Quick Details
Specifications
Specification
| NO. | Item | Capacity |
| 1 | Base Material for PCB | CEM-1 CEM-3 FR-1 FR-4, TACONIC, Aluminium, High Tg Material, High Frequence ROGERS, TEFLON, ARLON, Halogen-free Material |
| 2 | Rang of Finish Baords Thickness | 0.21-7.0mm |
| 3 | Max Size of Finish Board | 900MM*900MM |
| 4 | Minimum Line Width | 3mil (0.075mm) |
| 5 | Minimum Line Space | 3mil (0.075mm) |
| 6 | Min Space between Pad to Pad | 3mil (0.075mm) |
| 7 | Minimum Hole Diameter | 0.10 mm |
| 8 | Min Bonding Pad Diameter | 10mil |
| 9 | Max Proportion of Drilling Hole and Board Thickness |
01:13. |
| 10 | Minimum Line Width of Idents | 4mil |
| 11 | Min Height of Idents | 25mil |
| 12 | Finishing Treatment | HASL (Tin-Lead Free), ENIG(Immersion Gold), Immersion Silver , Gold Plating (Flash Gold), OSP, etc. |
| 13 | Solder Mask | Green, White, Red, Yellow, Black, Blue, Transparent Photosensitive Soldermask, Strippable Soldermask. |
| 14 | Minimun Thickness of Solder Mask |
10um |
| 15 | Color of Silk-screen | White, Black, Yellow etc. |
| 16 | E-Testing | 100% E-Testing (High Voltage Testing); Flying Probe Testing |
| 17 | Other Test | Impedance Testing,Resistance Testing,Microsection etc. |
| 18 | Date File Format | GERBER FILE and DRILLING FILE, PROTEL SERIES, PADS2000 SERIES, Powerpcb SERIES, ODB++ |
| 19 | Special Technological Requirement | Blind & Buried Vias and High Thickness copper |
| 20 | Thickness of Copper | 0.5-14oz (18-490um) |