| Brand Name: | htfuture |
|---|---|
| Wavelength: | 1310 |
| Data Rate: | 10g |
| warranty: | 3 |
| Connector: | lc |
| Model Number: | ht120245 |
| Place of Origin: | China (Mainland) |
| power: | 3.3v |
| color: | red |
| temp: | 80 |
Quick Details
Specifications
this Component is designed for use within the C -band release of DWDM system. AWG Device uses thermal-type thermal arrayed waveguide grating module with a unique Package design is based on a silicon substrate planar waveguide optical path (PLC) grating technology, the key modules, reduce power consumption, the Ad Hoc Working Group kit, use reliable thermal plastic, low thermal conductivity and Precise working temperature control, accurate channel coupling, low insertion Loss, high channel isolation and high stability.
Product Features
L Channel spacing 100GHZ (0.8 nm) up to 48 Channels can be multiplexed;
L High integration
L Low insertion loss, insertion loss ≤5dB, Typ 4.5dB
L High channel isolation:
Adjacent Isolation ≥25dB;
Non-adjacent Isolation ≥35dB
L Perfect indicator status;
L Advanced network management features:
Support SNMP, CLI, Web, management approach,
Full Graphical management
L HTF chassis compatibility:
Fit HTF-CH08 8-slot powered chassis
Fit HTF-CH16 16-slot powered chassis
Performance Parameters
Parameters |
Min |
Typ |
Max |
Units | |
Number of Channels |
40/48 |
||||
Channel Spacing |
100 |
GHz | |||
Cha. Center Wavelength |
C -band |
nm | |||
Center Frequency Accuracy |
±0.05 |
nm | |||
1 dB Passband |
0.4 |
nm | |||
3 dB Passband |
0.6 |
nm | |||
Insertion Loss Passband |
4.5 |
6.0 |
dB | ||
Adjacent Channel Isolation |
25 |
dB | |||
Non-Adjacent, Channel Isolation |
35 |
dB | |||
Total Crosstalk |
25 |
||||
Insertion Loss Uniformity |
1.5 |
dB | |||
Directivity(Mux Only) |
40 |
dB | |||
Insertion Loss Ripple |
0.5 |
dB | |||
Optical Return loss |
40 |
dB | |||
Polarization Dependent Loss(PDL) |
0.3 |
0.5 |
dB | ||
Polarization Mode Dispersion(PMD) |
0.5 |
ps | |||
Maximum Optical Power |
24 |
dBm | |||
Operating Temperature |
-5~+75 |
°C | |||
Storage Temperature |
-40~+85 |
°C | |||
Relative humidity |
5 to 95% maximum, non-condensing | ||||
Power Consumption |
≤25W |
W | |||
Package Dimension |
AWG Module |
W53 × D252 × H195 |
mm | ||
8-slot chassis |
W482.6 x D360 x H109 |
mm | |||
16-slot chassis |
W482.6 x D360 x H261.6 |
mm | |||
