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Quick Details

Surface Finishing: 1. HASL 2. HASL Leadfree 3. Deposited Nickel/Gold 4. OSP
Board Thickness: 0.5mm~5mm
Copper Thickness: 18um~75um
Base Material: CEM-3 FR4(130C Tg) Rogcrs4003 FR4(140C Tg) FR4(150-170C Tg)
Brand Name: Sendatec
Min. Line Spacing: 3mil
Min. Line Width: 3mil
Min. Hole Size: 0.2mm
Place of Origin: China (Mainland)

Specifications

  We are the manufacturer with ISO standard certification in GuangDong China that specialize in producing all kinds of PCB(print Circuit Board) with reliable quality. All products are selled by Factory Price.
  the price is variable according to the complexity of your design. You can send your inquiry with required documents( such as Gerber File, Protel or DXP format File, Cadence format File, PADS format file). We will reviews your files and reply in a few hours with competitive price and valuable comments & suggestions.
  We also have PCB SMT Production Line and can provide SMT service. If you have similar requirements, please contact us.

Specifications

1

NO. LAYER

1-32(Batch Process)
1-32 (Sample Board)

2

FINISHED BOARD SIZE (MAX)

520mm X 1040mm

3

BOARD THICKNESS (MAX)

5.0mm

4

BOARD THICKNESS (MIN)

0.50mm

5

DRILLED HOLE DIAMETER (MIN)

0.25mm

6

DIELECTRIC MATERIAL (MIN)

CEM-3 FR4(130C Tg)
Rogcrs4003 FR4(140C Tg)
FR4(150-170C Tg)

7

HOLE DIAMETER TOLERANCE (PTH)

+/-2mils(Batch Process)

8

HOLE DIAMETER TOLERANCE (NPTH)

+/-2mils(Batch Process)

9

LAYERLINE WIDTH/SPACING (MIN)

H/H Oz is 3mil/3mil
1/1 oz is 3mil/3mil
2/2 oz is 5mil/5mil

10

 SOLDER MASK THICKNESS (MIN)

10 Um

11 

IMPEDANCE TOLERANCE (MIN)

+/-10%

12

 Surface Processing

1. HASL
2. HASL Leadfree

3. Deposited Nickel/Gold
4. OSP

13

THERMAL STRESS TEST

288 Centigrade,10 sec
One Shot

14

FLAMMABILITY

94V-0


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