| Surface Finishing: | 1. HASL 2. HASL Leadfree 3. Deposited Nickel/Gold 4. OSP |
|---|---|
| Board Thickness: | 5.0mm |
| Copper Thickness: | 18um~75um |
| Base Material: | CEM-3 FR4(130C Tg) Rogcrs4003 FR4(140C Tg) FR4(150-170C Tg) |
| Brand Name: | sendatec |
| Min. Line Spacing: | 3mil |
| Min. Line Width: | 3mil |
| Min. Hole Size: | 0.2mm |
| Number of Layers: | |
| Place of Origin: | China (Mainland) |
Quick Details
Specifications
We are the manufacturer with ISO standard certification in GuangDong China that specialize in producing all kinds of PCB(print Circuit Board) with reliable quality. All products are selled by Factory Price.
the price is variable according to the complexity of your design. You can send your inquiry with required documents( such as Gerber File, Protel or DXP format File, Cadence format File, PADS format file). We will reviews your files and reply in a few hours with competitive price and valuable comments & suggestions.
We also have PCB SMT Production Line and can provide SMT service. If you have similar requirements, please contact us.
the price is variable according to the complexity of your design. You can send your inquiry with required documents( such as Gerber File, Protel or DXP format File, Cadence format File, PADS format file). We will reviews your files and reply in a few hours with competitive price and valuable comments & suggestions.
We also have PCB SMT Production Line and can provide SMT service. If you have similar requirements, please contact us.
Specifications | ||
1 |
NO. LAYER |
1-32(Batch Process) |
2 |
FINISHED BOARD SIZE (MAX) |
520mm X 1040mm |
3 |
BOARD THICKNESS (MAX) |
5.0mm |
4 |
BOARD THICKNESS (MIN) |
0.50mm |
5 |
DRILLED HOLE DIAMETER (MIN) |
0.25mm |
6 |
DIELECTRIC MATERIAL (MIN) |
CEM-3 FR4(130C Tg) |
7 |
HOLE DIAMETER TOLERANCE (PTH) |
+/-2mils(Batch Process) |
8 |
HOLE DIAMETER TOLERANCE (NPTH) |
+/-2mils(Batch Process) |
9 |
LAYERLINE WIDTH/SPACING (MIN) |
H/H Oz is 3mil/3mil |
10 |
SOLDER MASK THICKNESS (MIN) |
10 Um |
11 |
IMPEDANCE TOLERANCE (MIN) |
+/-10% |
12 |
Surface Processing |
1. HASL 3. Deposited Nickel/Gold |
13 |
THERMAL STRESS TEST |
288 Centigrade,10 sec |
14 |
FLAMMABILITY |
94V-0 |
