Usage

this machine is used to test solderability and heat stress for PCB.

Features

1.Internal container is made by special material that conforms to the lead-free standards.

2.Patented design that adopts PID temperature adjustment unit to create stable,uniform and precise temperatures.

3.Time adjustment and alarm functions

4.Conform to flexible PCB technical manual: GB/T 4677-2002;IPC-TM-650 2.4.12-1996; IPC-TM-650 2.4.13-1998.

Parameters

Item	SPECIFICATION
Model	KH23
Internal dimension	190×250×80(L×W×H)
Shape diameter	450×380×320(L×W×H)
Control box dimension	300×170×150(L×W×H)
Volume of soldering tin	1.90～2.53L (Weight about 13.4～18.0kg)
Temperature adjustment range	Room temperature ~300℃